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LT3743
PACKAGE DESCRIPTION
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
UFD Package
28-Lead Plastic QFN (4mm × 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)
0.70 ± 0.05
4.50 ± 0.05
3.10 ± 0.05
2.50 REF
2.65 ± 0.05
3.65 ± 0.05
0.25 ± 0.05
0.50 BSC
3.50 REF
4.10 ± 0.05
5.50 ± 0.05
PACKAGE OUTLINE
4.00 ± 0.10
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.75 ± 0.05
(2 SIDES)
R = 0.05
TYP
2.50 REF
R = 0.115
TYP
27
28
PIN 1 NOTCH
R = 0.20 OR 0.35
× 45 ° CHAMFER
5.00 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(NOTE 6)
3.50 REF
3.65 ± 0.10
2.65 ± 0.10
0.40 ± 0.10
1
2
(UFD28) QFN 0506 REV B
0.200 REF
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
3743fd
25
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